Thermoset offers advanced technology for the electronics market backed by superior technical support and global capabilities. Thermoset serves the circuit assembly, semiconductor packaging, automotive electronics, and general potting / encapsulation segments with a wide variety of materials. Thermoset’s advanced materials include: CircuitSAF - a full line of circuit assembly materials including surface mount adhesives, glob top encapsulants and cavity/dam encapsulants. Thermal management compounds include – adhesives, thermal greases, CoolPhase phase change pads, and Gelease thermal interface material. We offer advanced high thermally conductive die attach adhesives and specialty encapsulants for semiconductor packaging applications and electrical/electronic insulating materials for potting, encapsulation and impregnation. ISO 9001 and QS-9000 certified.

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